Kl. Choi et al., CHARACTERIZATION OF EMBEDDED PASSIVES USING MACROMODELS IN LTCC TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(3), 1998, pp. 258-268
This paper discusses the frequency and time domain response of embedde
d passive components in a multilayered structure fabricated using low
temperature co-fired ceramic (LTCC) technology. A rational polynomial
approximation that combines the accuracy of EM solvers with interpolat
ion methods has been used to capture the frequency dependent losses an
d parasitics of embedded passives in a macro-model. This method allows
for a significant: speed-up in computation time while using commercia
l EM solvers, The macromodel with suitable modification has been used
to compute the time domain response in SPICE for typical embedded pass
ive structures. Simulation results show good correlation with time dom
ain reflectometry/time-domain-transmission (TDR/TDT) measurements, The
behavior of embedded passives in the high frequency operation of tran
smission lines and voltage divider networks has also been discussed.