LOW-COST ALGAAS GAAS HBT MULTIGIGABIT LIMITING AMPLIFIER PACKAGED WITH A NEW PLASTIC AIR TIGHT CAVITY ENCAPSULATION PROCESS/

A multigigabit limiting amplifier integrated circuit (IC) for optical transmission system was implemented with AlGaAs HBT technology and pac kaged in a plastic-molded-bottom-ground air-cavity package using an al pha-staged thermally setting epoxy which comes in a gel in an uncured state. The amplifier was designed to support differential input and ou tput. Small signal performance of the packaged IC achieves 31 dB gain and f(3) (dB) of 4.6 GHz, A single output has 1.0 Vp-p swing with more than 32 dB dynamic range up to 5 Gb/s, The measured bit error rate ap plying to APD optical receiver at 2.5 Gb/s bit rate is -33.5 dBm at 1 x 10(-10) EER with 2(23)-1 long 2.5 Gb/s NRZ PRBS pattern, The present packaging method was verified by subjecting it to the industry standa rd condition ''c'' gross leak test and the overall yield of the air ca vity encapsulation process is more than 99%. This method is readily ca pable of mass production using automated equipment.