A study of manifold microchannel (MMC) heat sinks for forced air cooli
ng was performed experimentally. The manifold microchannel heat sink d
iffers from a traditional microchannel (TMC) heat sink in that the flo
w length is greatly reduced to a small fraction of the total length of
the heal sink. In other words, the MMC heat sink features many inlet
and outlet channels, alternating at a periodic distance along the leng
th of the microchannels while the TMC heat sink features one inlet and
one outlet channels. The present study primarily focused to investiga
te the effects of geometrical parameters on the thermal performance of
the manifold microchannel heat sinks for optimal design. Also, the th
ermal resistances of the MMC heat sinks were compared with those of th
e TMC heat sinks. Experimental results showed the thermal resistances
of MMC heat sinks were affected strongly by the pumping power, the mic
rochannel width and the manifold inlet/outlet channel width, but weakl
y by the microchannel thickness-width ratio and the microchannel depth
coorporated with the manifold inlet/outlet channel width. However, it
was found that there existed the optimum values of the latter paramet
ers. Under the optimum condition of geometrical parameters in the pres
ent study, the thermal resistance of the MMC heat sink was approximate
ly 35% lower than that of a TMC heat sink, which clearly demonstrated
the effectiveness of using a manifold.