MICROVIAS - THE NEXT-GENERATION OF SUBSTRATES AND PACKAGES

Authors
HOLDEN H
Citation
H. Holden, MICROVIAS - THE NEXT-GENERATION OF SUBSTRATES AND PACKAGES, IEEE MICRO, 18(4), 1998, pp. 10-16
Citations number
4
Categorie Soggetti
Computer Science Hardware & Architecture","Computer Science Software Graphycs Programming","Computer Science Hardware & Architecture","Computer Science Software Graphycs Programming
Journal title
IEEE MICRO → ACNP
ISSN journal
02721732
Volume
18
Issue
4
Year of publication
1998
Pages
10 - 16
Database
ISI
SICI code
0272-1732(1998)18:4<10:M-TNOS>2.0.ZU;2-S
Abstract
Smaller printed circuit and wiring boards help solve the dilemma of in creased functionality on reduced component sizes.