High Performance Polymers. especially when inherently flame retardant,
are of potential interest for electrotechnical and electronic applica
tions and are systematically investigated. In the course of R&D work o
n these materials - in spite of a number of properties of high interes
t - some deficiencies were found as, for example, predominantly poor m
etal adhesion. Further, in individual cases they possess poor stress c
racking resistance, limited thermal stability and/or only medium hydro
lytic stability. Moreover the industrial application of HPP is hindere
d by higher prices and nonavailability in larger quantities. In case o
f no success in current efforts (tailor made blends, surface modificat
ion) these deficiencies might contribute to a certain decline of HP po
lymers as already observed in a few cases.