FINITE-ELEMENT ANALYSIS OF MOISTURE DISTRIBUTION AND HYGROTHERMAL STRESSES IN TSOP IC PACKAGES

Authors
YI S SZE KY
Citation
S. Yi et Ky. Sze, FINITE-ELEMENT ANALYSIS OF MOISTURE DISTRIBUTION AND HYGROTHERMAL STRESSES IN TSOP IC PACKAGES, Finite elements in analysis and design, 30(1-2), 1998, pp. 65-79
Citations number
7
Categorie Soggetti
Mathematics,Engineering,Mechanics,Mathematics
Journal title
Finite elements in analysis and design → ACNP
ISSN journal
0168874X
Volume
30
Issue
1-2
Year of publication
1998
Pages
65 - 79
Database
ISI
SICI code
0168-874X(1998)30:1-2<65:FAOMDA>2.0.ZU;2-F
Abstract
In this study, the finite element analysis of moisture absorption and residual stresses in plastic encapsulated IC packages is presented. Du ring the moisture soaking test, moisture distributions in plastic enca psulated IC packages are evaluated by solving the diffusion equations. Thin LOC TSOP packages in various moisture soaking conditions are con sidered. The effects of temperature and humidity conditions on moistur e distributions in TSOP packages are investigated in order to assess p roduct reliability. Hygro-thermally induced deformations and stresses in plastic IC packages are also evaluated. (C) 1998 Elsevier Science B .V. All rights reserved.