APPLICATIONS OF FEM FOR MULTIPLE LAMINATED STRUCTURE IN ELECTRONIC PACKAGING

A special finite-element method for multiple laminated structure, prev iously proposed by the authors, is presented here. It can provide attr active results without three-dimensional finite-element discretization and can be applied to electronic packaging problems. The thermal stre ss analysis of the basic IC model, the practical IC model with lead fi ngers and the electronic printed board with solder bump joints are sel ected as the problems to deal with, and analyzed in detail. From the r esults of the basic IC model, the influences of varying chip size and package thickness for the stress distributions, are presented. The cau ses of failure for the real IC device are presented from the results o f the practical IC model. In addition, influences of the solder joint arrangements for the thermal stresses are presented from the results o f the electronic printed board with solder bump joints. (C) 1998 Elsev ier Science B.V. All rights reserved.