Miniaturisation and integration of passive components play an importan
t role in today's components market. It can be achieved by applying th
in-film technologies for capacitors, resistors and inductors; high com
ponent densities have been realised with 'Passive Only Networks'. The
dielectric materials used for integrated thin-film capacitors ranging
from Si3N4, Ta2O5, TiO2 to earth alkaline as well as lead perovskite l
ayers are reviewed. The capacitor performances including temperature s
tability, insulation resistance, breakdown fields and endurance are di
scussed as a function of material composition.