SOME ISSUES FOR MICROSYSTEM PACKAGING IN PLASTIC AND 3D

This paper describes some of the key issues associated with the packag ing of microsystems in plastic and 3D. These include hermeticity, resi dual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress prob lems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf compone nts are outlined. (C) 1998 Elsevier Science Ltd. All rights reserved.