J. Nassar et al., MAGNETORESISTANCE OF FERROMAGNETIC TUNNEL-JUNCTIONS WITH AL2O3 BARRIERS FORMED BY RF SPUTTER ETCHING IN AR O-2 PLASMA/, Applied physics letters, 73(5), 1998, pp. 698-700
Co/Al2O3/Ni80Fe20 tunnel junctions were grown by sputtering at room te
mperature on glass and Si substrates, the barrier being formed by rf s
putter etching of aluminum in a Ar/O-2 plasma. The resistance is contr
olled for a given junction area by adjusting the oxide barrier thickne
ss. Magnetoresistance ratios of 16% at 4.2 K and 6% at room temperatur
e are obtained with good reproducibility over three orders of magnitud
e of resistance. Effects related to substrate shunting and oxidation o
f the bottom Co electrode are discussed. (C) 1998 American Institute o
f Physics. [S0003-6951(98)04031-5].