The electronic and ionic contributions to the overall dielectric const
ant of fluorinated SiO2 films deposited in SiF4 and O-2 plasmas were q
uantified from the refractive index measured by in situ spectroscopic
ellipsometry in the visible-to-UV range and the infrared spectra taken
by in situ attenuated total reflection Fourier transform infrared spe
ctroscopy. The Kramers-Kronig dispersion relations facilitated the com
putation of ionic contribution to the dielectric constant from the IR
absorbance spectra. The dependence of the dielectric response of SiO2
films on the SiF4-to-O-2 ratio (R) in the feed gas mixture revealed th
at F incorporation leads to a decrease in both electronic and ionic co
ntributions, thus reducing the overall dielectric constant. The electr
onic component, for instance, comprised 1/3 of the total dielectric co
nstant above the vacuum level and decreased with increasing F content
until SiF4-rich plasma resulted in a-Si incorporation. The rate of dec
rease, however, showed a sudden change at R = 0.25. Below the ratio, t
he Si-O-Si bond angle relaxation in the SiO2 matrix and the subsequent
density reduction were largely responsible for a moderate rate of dec
rease in the electronic contribution. Above this ratio, inclusion of v
oids caused a more pronounced decrease in the electronic contribution.
The ionic component, which comprised less than 1/3 of the total diele
ctric constant, similarly decreased with increasing F content. This de
crease was attributed to the replacement of more ionic Si-O bonds with
Si-F bonds. The ionic contributions, whose characteristic vibrational
frequencies appear below our experimentally observable range, constit
uted the remaining 1/3 and remained constant at 1, independent of fluo
rine concentration. Based on these observations, we propose a method t
o predict the total dielectric constant of SiOF films deposited in SiF
4/O-2 plasmas from a combination of ellipsometric and infrared absorpt
ion measurements. (C) 1998 American Institute of Physics.