M. Shima et al., STRUCTURAL AND MAGNETIC FOURFOLD SYMMETRY OF CO CU MULTILAYERS ELECTRODEPOSITED ON SI(001) SUBSTRATES/, Journal of applied physics, 84(3), 1998, pp. 1504-1507
We have observed in-plane fourfold symmetry of the magnetization and m
agnetoresistance in Co/Cu multilayers electrodeposited on Si(001) subs
trates covered with a thin evaporated Cu seed layer. The fourfold symm
etry correlates with the in-plane crystalline structure of the multila
yers. High-angle x-ray diffraction shows that the Co/Cu multilayers ha
ve a strong (001) texture. Phi-scan x-ray diffraction reveals that the
multilayers have fourfold symmetry in the plane with a 45 degrees rot
ation with respect to the Si substrates. We estimated an anisotropy fi
eld of 98 mT from vector magnetization curves, which is in fairly good
agreement with the value obtained from Co/Cu multilayers electrodepos
ited on (001) Cu single crystal substrates. The giant magnetoresistanc
e appears to depend on the in-plane orientation of the multilayer due
to the magnetocrystalline anisotropy. (C) 1998 American Institute of P
hysics. [S0021-8979(98)00415-0].