J. Schafer et al., DEPTH-DEPENDENT SPECTROSCOPIC DEFECT CHARACTERIZATION OF THE INTERFACE BETWEEN PLASMA-DEPOSITED SIO2 AND SILICON, Applied physics letters, 73(6), 1998, pp. 791-793
We demonstrate the use of low-energy cathodoluminescence spectroscopy
(CLS) to study optical transitions at defect bending arrangements at S
i-SiO2 interfaces prepared by low-temperature plasma deposition. Varia
ble-depth excitation achieved by different electron injection energies
provides a clear distinction between luminescence derived from (i) th
e near-interface region of the oxide film, (ii) the Si-SiO2 interface,
and (iii) the underlying crystalline Si substrate. Cathodoluminescenc
e bands at similar to 0.8 and 1 eV are assigned to interfacial Si atom
dangling bonds with different numbers of back-bonded Si and O atoms.
CLS also reveals higher photon energy features: two bands at similar t
o 1.9 and 2.7 eV assigned to suboxide bonding defects in the as-grown
oxide films, as well as a substrate-related feature at similar to 3.4
eV. The effects of hydrogenation at 400 degrees C and rapid thermal an
nealing at 900 degrees C, and especially the combination of both proce
ss steps is shown to dramatically reduce the intensities of the CLS fe
atures assigned to interfacial and suboxide bonding defects. (C) 1998
American Institute of Physics. [S0003-6951 (98)03632-8].