Chemically amplified photoresists are widely used throughout the semic
onductor industry clue to the need for high throughput in the lithogra
phy process, Knowledge of the location of acid molecules in chemically
amplified resists is of paramount importance for the process control
of the image formation of almost all the lithographic techniques used
in the semiconductor industry today. We have demonstrated a technique
based on pH-dependent fluorescence which can measure directly the spat
ial distribution of the photoacid in photoresist films without the nee
d of any other subsequent process after exposure. By adding a small am
ount of fluorescent material to the resist, a latent image can be form
ed when photogenerated acid molecules quench the fluorescence in expos
ed areas. We demonstrate images formed after exposure of SAL605 resist
films to x-ray radiation, with no post-exposure bake, and show that t
he optical contrast is a function of dose. We also show that the same
technique can be utilized for rapid evaluation of photoacid generator
efficiency. (C) 1998 American Institute of Physics.