ENGINEERING SURFACES IN CERAMIC PIN GRID ARRAY PACKAGING TO INHIBIT EPOXY BLEEDING

Authors
TAN NX LIM KHH CHIN B BOURDILLON AJ
Citation
Nx. Tan et al., ENGINEERING SURFACES IN CERAMIC PIN GRID ARRAY PACKAGING TO INHIBIT EPOXY BLEEDING, HEWLETT-PAC, 49(3), 1998, pp. 81-90
Citations number
10
Categorie Soggetti
Engineering, Eletrical & Electronic","Instument & Instrumentation","Computer Science Hardware & Architecture
Journal title
HEWLETT-PACKARD JOURNAL
ISSN journal
00181153 → ACNP
Volume
49
Issue
3
Year of publication
1998
Pages
81 - 90
Database
ISI
SICI code
0018-1153(1998)49:3<81:ESICPG>2.0.ZU;2-U
Abstract
Bleeding of epoxy resin around surfaces undergoing bonding during elec tronic packaging assembly has long caused sporadic yield loss. Previou sly. it was thought that vacuum baking reduced the yield lass resultin g from surface cotaminants. Although vacuum baking inhibits epoxy resi n bleeding, it a so produces coatings of hydrocarbons, which affect su rface wettability and surface energy. Surfactant coating results in a surface chemistry similar to vacuum-baked substrates but is a better a lternative because of its controllability.