AlSb/InAs HEMTs with a 0.1 mu m gate length have been fabricated with
a thin InAs subchannel separated from the InAs channel by 30 Angstrom
of AlSb. As a result, these HEMTs exhibit improved charge control and
a higher current-gain cutoff frequency. The devices have a microwave t
ransconductance of 850 mS/mm and an f(T) of 180 GHz at V-DS = 0.6 V. A
fter subtracting the gate bonding pad capacitance, an f(T) of 250 GHz
was obtained.