GLASS-TO-GLASS ELECTROSTATIC BONDING FOR FED TUBELESS PACKAGING APPLICATION

Authors
JU BK CHOI WB LEE YH JUNG SJ LEE NY HAN JI CHO KI OH MH
Citation
Bk. Ju et al., GLASS-TO-GLASS ELECTROSTATIC BONDING FOR FED TUBELESS PACKAGING APPLICATION, Microelectronics, 29(11), 1998, pp. 839-844
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics → ACNP
ISSN journal
00262692
Volume
29
Issue
11
Year of publication
1998
Pages
839 - 844
Database
ISI
SICI code
0026-2692(1998)29:11<839:GEBFFT>2.0.ZU;2-T
Abstract
Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bo nded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si= #7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for th e electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pai rs. This glass-to-glass electrostatic bonding process can be applied t o the clean and tubeless packaging of field emission display panels. ( C) 1998 Elsevier Science Ltd. All rights reserved.