A third dimension has come to the circuits and assemblies of Merri- ma
c Industries (West Caldwell, NJ). This long-traditional supplier L of
planar high-frequency components and subassemblies has developed Multi
-Mix(TM), a three-dimensional (3D) technique of stacking soft-substrat
e circuits that results in dramatic space savings and performance impr
ovements. As an example, the firm has created a 28-channel, two-module
Multi-Mix filter bank measuring 3 x 4 x 0.37 in. (7.62 x 10.16 x 0.94
cm) and weighing less than 2 oz. (56 g). It replaces an assembly of I
ft.(3) and 13 Ibs. (5.85 kg). The Multi-Mix technology has been demon
strated in designs at frequencies through Ka-band.