Humidity combined with temperature and voltage is considered a major f
ailure stimulus in electronic components, printed wiring boards, and a
ssemblies. Accelerated temperature/humidity tests are commonly used to
evaluate the moisture resistance of electronics, but these are rarely
linked to the application environment. This work proposes a methodolo
gy to determine realistic rests based on measured usage environments.
Plastic encapsulated microcircuits in the commercial airplane environm
ent will be used to demonstrate the approach.