TAILORING TEMPERATURE HUMIDITY LIFE TESTS WITH IN-SERVICE ENVIRONMENTDATA/

Citation
Kd. Cluff et Db. Barker, TAILORING TEMPERATURE HUMIDITY LIFE TESTS WITH IN-SERVICE ENVIRONMENTDATA/, Journal of the IEST, 41(4), 1998, pp. 36-42
Citations number
12
Categorie Soggetti
Environmental Sciences","Instument & Instrumentation","Engineering, Environmental
Journal title
ISSN journal
10984321
Volume
41
Issue
4
Year of publication
1998
Pages
36 - 42
Database
ISI
SICI code
1098-4321(1998)41:4<36:TTHLTW>2.0.ZU;2-5
Abstract
Humidity combined with temperature and voltage is considered a major f ailure stimulus in electronic components, printed wiring boards, and a ssemblies. Accelerated temperature/humidity tests are commonly used to evaluate the moisture resistance of electronics, but these are rarely linked to the application environment. This work proposes a methodolo gy to determine realistic rests based on measured usage environments. Plastic encapsulated microcircuits in the commercial airplane environm ent will be used to demonstrate the approach.