Co-Ni-Cu/Cu multilayers have been electrodeposited directly onto n-typ
e Si substrates. This removes the need to use a seed-layer deposited b
y some other method as part of the growth process and makes electrodep
osition a significantly more convenient method for fabricating films t
hat exhibit giant magnetoresistance (GMR). A maximum GMR of over 10% a
nd a sensitivity of over 0.04%/Oe were recorded. The GMR and sensitivi
ty of the multilayers both increase with increasing Cu layer thickness
. (C) 1998 American Institute of Physics.