Laser ablation of silicon surfaces with various dopant concentrations
is studied by the irradiation of pulsed CO2 laser. Silicon ions with t
he charge ranging from 1 to 4 au are observed in the emitted species.
The fraction of the multiple charged ions increases with an increasing
dopant concentration. The kinetic energy of Si ions, determined by th
e time-of-flight measurement, extends up to similar to 300 eV, and is
almost independent of the dopant concentration. The results can be exp
lained by a positive charging of the irradiated spot during the laser
irradiation.