T. Lohner et al., SPECTROELLIPSOMETRIC CHARACTERIZATION OF ION-IMPLANTED SEMICONDUCTORSAND POROUS SILICON, Acta physica slovaca, 48(4), 1998, pp. 441-450
In the past years spectroscopic ellipsometry (SE) was applied to mater
ials science problems as an optical technique for non destructive dept
h profiling and characterization of multilayer structures and interfac
es with considerable success. The measured optical response of the mul
ticomponent and/or multilayer structure under investigation can only b
e related to actual material properties by a model calculation. The su
ccessful application of ellipsometry is not only determined by the qua
lity of the measurements, but more importantly by the quality of the o
ptical model. Several examples for the different application of SE are
reviewed. Two recent examples of multilayer analysis illustrate possi
bilities: in the first example damage created by ion implantation in s
ingle-crystalline silicon and in silicon carbide was characterized usi
ng ellipsometry and Rutherford Backscattering Spectrometry (RBS) in co
mbination with channeling. In the second example electrochemically pre
pared porous silicon layers (PSL) were investigated by SE.