A. Giridhar et S. Mahadevan, MEAN ATOMIC VOLUME, T-G AND ELECTRICAL-CONDUCTIVITY OF CU-X(AS0.4TE0.6)(100-X) GLASSES, Journal of non-crystalline solids, 238(3), 1998, pp. 225-233
Results of measurements of the mean atomic volume (V), the glass trans
ition temperature (T-g) and the electrical conductivity (sigma) on 12
compositions of the Cu-x(As0.4Te0.6)(100-x) glasses, with x from 0 to
20 at.%, are reported and discussed. A reduction in V and a constancy
of T-g, are observed as Cu varies from 0 to 3 at.%. To this stage, the
Cu atoms occupy interlayer positions in the layered network of the pa
rent As0.4Te0.6 glass. The sigma of glasses with less than or equal to
3 at.% of Cu, are less than that of the parent glass. For Cu > 3 at.%
, Cu forms bonds with Te and the glasses become regular three componen
t As-Te-Cu glasses. Due to this bonding, changes in slope occur in the
V as a function of composition and T-g as a function of composition a
t Cu content of 3 at.%. The results are examined using a model which e
nvisages the formation of Cu2Te, As2Te3 and As structural units in the
se glasses. For Cu > 3 at.%, a decrease of the conductivity activation
energy and an increase of sigma occur with increasing Cu content. (C)
1998 Published by Elsevier Science B.V. All rights reserved.