J. Ohshita et al., POLYMERIC ORGANOSILICON SYSTEMS - XXIX - THERMAL-PROPERTIES OF POLY[(DISILANYLENE)OLIGOPHENYLENES], Journal of organometallic chemistry, 564(1-2), 1998, pp. 47-56
Thermal properties of variously substituted poly[(disilanylene)oligoph
enylenes], [((SiRR2SiRR2)-R-1-R-1)(p -C6H4)(m)](n) (R-1 = R-2 = Me, R-
1 = R-2 = Et, and R-1 = Ph, R-2 = Me, m = 1-4) were investigated. The
thermogravimetric analysis of the polymers in the range of 20-1000 deg
rees C showed rapid weight loss starting from about 400 degrees C. The
total weight loss of the polymers at 1000 degrees C was calculated to
be 54.5-75.5% based on the initial weight of the polymers. GC-MS anal
ysis of the volatile products obtained from the pyrolysis of the polym
ers with R-1 = R-2 = Me, m = 2 and R-1 = R-2 = Et, m = 1-4 at 500 degr
ees C indicated the formation of silicon-containing oligomers arising
from the Si-Si and Si-phenylene bond cleavage, mainly. The formation o
f oligophenylenes, H(C6H4)(1)H (l = 1-4), was also observed in the pyr
olysis of the polymers with m = 3 and 4. A model reaction for the poly
mer degradation was also examined, using 1,2-diphenyltetramethyldisila
ne. (C) 1998 Elsevier Science S.A. All rights reserved.