FLUIDIC INTERCONNECTS FOR MODULAR ASSEMBLY OF CHEMICAL MICROSYSTEMS

A new assembly technology is presented which enables the modular inter connection, assembly and packaging of individual microfabricated compo nents and/or modules (e.g., pumps, valves, reaction chambers, control circuitry, etc.). This technology can be used to make compression seal fittings utilizing self-aligning, interlocking, mechanical bonding st ructures and photo-patternable silicons O-ring seals. Two distinct typ es of fluidic interconnects for microfluidic system assembly are demon strated using this technology. The first type demonstrates a means of interconnecting multiple, vertically stacked layers of micromachined c hannels. The second type demonstrates a means of connecting micromachi ned channels to tubing or other micromachined channels within the same plane. An important feature of these interconnects are that they are reversible, i.e., interconnections can be repeatedly made with the sam e structures allowing flexible system assembly. (C) 1998 Elsevier Scie nce S.A. All rights reserved.