Silver contacts to single-crystal Bi(2)Sr(2)CaCu(2)Ox (Bi-2212) and po
lycrystalline (Bi,Pb)(2)Sr2Ca2Cu3Ox (Bi-2223) were prepared by sputter
ing or sinter-forging techniques. The interfacial resistivity of Ag/Bi
-2212, defined as interfacial resistance times contact area, decreased
from 10(-4) to 10(-10) Ohm cm(2) at 77 K when the thermal annealing t
ime increased from 1 to 14 h at 600 degrees C; it was also a function
of the annealing temperature. The lowest interfacial resistivity of Ag
/Bi-2223 that was sinter-forged at 840-845 degrees C for 1 h was 10(-9
) Ohm cm(2) at 77 K. Experimental data are compared with intrinsic int
erfacial resistivity and resistivity values found in the literature.