Jp. Eloundou et al., COMPARATIVE RHEOLOGICAL ANALYSIS OF 2 EPOXY-AMINE SYSTEMS NEAR THE GEL POINT, European Polymer Journal, 34(9), 1998, pp. 1331-1340
A flexible epoxy-amine system based on diglycidylether of 1,4-butanedi
ol (DGEBD) and 4,9-dioxa 1,12-dodecane diamine (4D) and a rigid epoxy-
amine system based on diglycidyl ether of bisphenol A (DGEBA) and 4,3'
-methylenebis [3-chloro, 2.6-diethylaniline] (MCDEA) were studied by r
heological method near the gel point. The maximum glass transition tem
perature of the completely cured network, T-g infinity, is low for DGE
BD/4D system (T-g infinity = - 12 degrees C). Then, this system presen
ts only gelation transition at curing temperatures between 50 degrees
C and 70 degrees C. T-g infinity (T-g infinity = 177 degrees C) is hig
h for DGEBA/MCDEA system which presents gelation and vitrification bet
ween 80 degrees C and 170 degrees C, but only gelation at 180 degrees
C and 190 degrees C. At the gel point, it is observed a divergence of
the viscosity in steady flow conditions, a crossover of the tan delta
curves measured as a function of time at several frequencies, and prop
ortionality between G'(omega), G ''(omega) and the power Delta of the
pulsation omega(G'(omega)proportional to G ''(omega)proportional to om
ega(Delta)). Near the gel point, the viscosity, eta, and the elastic m
odulus, G', follows power laws (eta proportional to epsilon(-k) and G'
proportional to epsilon(Z) with epsilon = \x - x(gel)\/x(gel), relativ
e distance to the gel). At curine temperatures higher than T-g infinit
y the critical exponents k, z(0) and Delta remain constant and their v
alues are in good agreement with those derived from the percolation th
eory with molecular chains corresponding to the Rouse model. Between 1
50 degrees C and 170 degrees C, k and Delta have a constant value for
DGEBA/MCDEA system. The exponent z is the most sensitive to vitrificat
ion phenomenon. Below 150 degrees C, k and Delta diminish and exponent
z no longer exists, which indicates lack of fractality at low curing
temperatures. (C) 1998 Elsevier Science Ltd. All rights reserved.