This paper integrates simulated annealing-based component packing, lay
out and routing algorithms into a concurrent approach to product layou
t optimization. The design of a heat pump is presented to compare the
integrated method to the previous sequential layout-then-route approac
h; results show a substantial improvement in route design with more or
ganized component placements. The example is given in detail to provid
e a test case for future research in this area.