QUANTIZED CONDUCTANCE IN A SMALL ONE-DIMENSIONAL SI WIRE ON A THIN SILICON-ON-INSULATOR SUBSTRATE FABRICATED USING SIN-FILM-MASKED OXIDATION

Citation
Y. Takahashi et al., QUANTIZED CONDUCTANCE IN A SMALL ONE-DIMENSIONAL SI WIRE ON A THIN SILICON-ON-INSULATOR SUBSTRATE FABRICATED USING SIN-FILM-MASKED OXIDATION, Semiconductor science and technology, 13(9), 1998, pp. 1047-1051
Citations number
15
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Condensed Matter","Material Science
ISSN journal
02681242
Volume
13
Issue
9
Year of publication
1998
Pages
1047 - 1051
Database
ISI
SICI code
0268-1242(1998)13:9<1047:QCIASO>2.0.ZU;2-Z
Abstract
A new fabrication technique for a one-dimensional (1D) Si wire on a se paration-by-implanted-oxygen (SIMOX) substrate, which is effective in reducing the parasitic resistance caused by the thin lead Si regions, is proposed. Thermal oxidation of the Si layer on which a stacked stru cture of SiO2 and SIN films is formed does not reduce the thickness of the wide two-dimensional (2D) Si layer, though the 1D wire becomes th inner by the oxidation. A MOS-type 1D Si wire fabricated using this te chnique shows a clear step-like conductance as a function of gate volt age. Though the measured conductance step is slightly lower than the t heoretically predicted value, it is much larger than previously report ed values. The inherent conductance of the 1D wire can be extracted fr om the measured overall conductance owing to low parasitic resistance. The first conductance step thus obtained agrees well with the theoret ical value of 4e(2)/h.