Y. Takahashi et al., QUANTIZED CONDUCTANCE IN A SMALL ONE-DIMENSIONAL SI WIRE ON A THIN SILICON-ON-INSULATOR SUBSTRATE FABRICATED USING SIN-FILM-MASKED OXIDATION, Semiconductor science and technology, 13(9), 1998, pp. 1047-1051
A new fabrication technique for a one-dimensional (1D) Si wire on a se
paration-by-implanted-oxygen (SIMOX) substrate, which is effective in
reducing the parasitic resistance caused by the thin lead Si regions,
is proposed. Thermal oxidation of the Si layer on which a stacked stru
cture of SiO2 and SIN films is formed does not reduce the thickness of
the wide two-dimensional (2D) Si layer, though the 1D wire becomes th
inner by the oxidation. A MOS-type 1D Si wire fabricated using this te
chnique shows a clear step-like conductance as a function of gate volt
age. Though the measured conductance step is slightly lower than the t
heoretically predicted value, it is much larger than previously report
ed values. The inherent conductance of the 1D wire can be extracted fr
om the measured overall conductance owing to low parasitic resistance.
The first conductance step thus obtained agrees well with the theoret
ical value of 4e(2)/h.