Thermal conductivity of an intermetallic compound is characterized as
an enhancement due to ordering with reference to the basic contributio
n of solid solutions. A necessary condition of having high thermal con
ductivity of a given intermetallic compound is, therefore, that the so
lid solution itself transports high thermal current. A periodic table
in helical form for seeking the high conductivity compound is proposed
by summarizing the electrical resistivity data of solid solutions. As
sessments of thermal conductivity were conducted for the intermetallic
compounds based on noble metals. Cu3Au, CuAu and AgMg show the maximu
m value for 157, 167 and 147 W m(-1) K-1 at ambient temperature among
L1(2), L1(0) and B2 compounds, respectively. (C) 1998 Elsevier Science
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