A new type of contactless wafer manipulator, featuring ''direct electr
ostatic levitation and propulsion of silicon wafer (DELP-SW),'' has be
en successfully developed, The novel aspect of this manipulator is tha
t a silicon wafer can be directly levitated and driven via electrostat
ic forces. In this paper, a brief review of basic principles is presen
ted. This is followed by a description of the structure of a prototype
DELP-SW mechanism, including electrode design, position feedback cont
rol method, driving principle, and the operational procedure. Experime
ntal results, which demonstrate completely contactless transportation
of an 8-in silicon wafer, are also presented.