N. Ohtsuka et al., COPPER(I) CHLORIDE-PYRIDINE COMPLEX SUPPORTED ON SILICA-GEL AS ADSORBENT FOR CARBON-MONOXIDE, Nippon kagaku kaishi, (9), 1998, pp. 609-618
A copper(I) chloride-pyridine complex supported on silica gel was prep
ared by mixing porous silica gel beads with an acetonitrile solution c
ontaining the complex composed of copper(I) chloride (CuCl) and pyridi
ne under nitrogen, followed by removal of liquid phase under reduced p
ressure. The resulting silica gel, 5.8 g, contained 4.39 mmol of CuCl
and 4.08 mmol of pyridine. It rapidly adsorbed carbon monoxide (CO) at
30 degrees C under 1.0 atm of CO, and the equilibrium amount of adsor
bed CO was 3.29 mmol (80.6% against containing pyridine). The adsorbed
CO was rapidly desorbed by maintaining it at 70 degrees C under 1.0 a
tm or at 30 degrees C under 0.4 mmHg. The adsorption-desorption cycle
was repeated without any deterioration. The equilibrium amount of adso
rbed CO (3.29 mmol) was 5.5 times that of adsorbed carbon dioxide (0.6
0 mmol), and 36.6 times that of adsorbed methane (0.09 mmol) at 30 deg
rees C under 1.0 atm. The reversible and selective adsorption of CO wa
s attributed to formation of molar ratio 1 : 1 : 1 CuCl-pyridine-CO co
mplex from CO molecule and molar ratio 1 : 1 CuCl-pyridine complex sup
ported on silica gel. When the adsorbent contacted with oxygen, the CO
adsorbing ability decreased. The adsorbing ability was completely rec
overed by maintaining the adsorbent at 120 degrees C under 1.0 atm of
hydrogen for 48 h.