Mesoscopic systems are the bridge forming the micromachining domain in
to the macro-world. Additional challenges and opportunities are presen
ted by mesoscopic systems. They require more 3-dimensionality than mic
romachined structures, provide the mechanical interface to the environ
ment (i.e. act as the package) and must resolve the difference in tole
rances between the macro-fabricated devices and the high precision mic
rofabricated devices. An ideal fabrication technology for mesoscopic s
ystem is deep X-ray lithography (DXRL) and assembly. The high precisio
n in the X, Y and Z dimensions of the DXRL-fabricated components provi
de unique opportunities for increased functionality and 3-dimensionali
ty of mesoscopic systems. The fabrication, assembly, tolerance and met
rology issues of DXRL fabrication of mesoscopic systems are presented.
Application of these design issues to mesoscopic fluidic systems will
be presented, with specific examples including a magnetically coupled
gear pump, a gear pump driven directly by miniature brushless DC moto
r, and the fluid flat-pack, a general purpose packaging methodology fo
r fluidic devices. (C) 1998 Published by Elsevier Science Ltd. All rig
hts reserved.