An. Andreev et al., ALLOWING FOR CURRENT SPREADING IN SEMICONDUCTORS DURING MEASUREMENTS OF THE CONTACT RESISTIVITY OF OHMIC CONTACTS, Semiconductors (Woodbury, N.Y.), 32(7), 1998, pp. 739-744
A modification of the contact-area pattern with radial geometry, which
has certain advantages in determining the contact resistivity of ohmi
c contacts (rho(c)) fabricated on substrates and low-resistance semico
nductor layers, is proposed. Different variants of its application for
both the transmission line method (TLM) and methods based on a numeri
cal calculation of the resistance of the semiconductor with allowance
for current spreading are considered. It is shown that the transmissio
n line method makes it possible to obtain an upper estimate of the con
tact resistivity on substrates. The errors of such estimates are also
calculated as a function of the parameters of the semiconductor and th
e contact. The TLM estimate is a good first approximation for determin
ing the exact value of rho(c) by numerically calculating the resistanc
e of the semiconductor. The results obtained are used to study the con
tact resistivity of Ni-based ohmic contacts on n-6H-SiC substrates. (C
) 1998 American Institute of Physics.