ALLOWING FOR CURRENT SPREADING IN SEMICONDUCTORS DURING MEASUREMENTS OF THE CONTACT RESISTIVITY OF OHMIC CONTACTS

Citation
An. Andreev et al., ALLOWING FOR CURRENT SPREADING IN SEMICONDUCTORS DURING MEASUREMENTS OF THE CONTACT RESISTIVITY OF OHMIC CONTACTS, Semiconductors (Woodbury, N.Y.), 32(7), 1998, pp. 739-744
Citations number
15
Categorie Soggetti
Physics, Condensed Matter
ISSN journal
10637826
Volume
32
Issue
7
Year of publication
1998
Pages
739 - 744
Database
ISI
SICI code
1063-7826(1998)32:7<739:AFCSIS>2.0.ZU;2-L
Abstract
A modification of the contact-area pattern with radial geometry, which has certain advantages in determining the contact resistivity of ohmi c contacts (rho(c)) fabricated on substrates and low-resistance semico nductor layers, is proposed. Different variants of its application for both the transmission line method (TLM) and methods based on a numeri cal calculation of the resistance of the semiconductor with allowance for current spreading are considered. It is shown that the transmissio n line method makes it possible to obtain an upper estimate of the con tact resistivity on substrates. The errors of such estimates are also calculated as a function of the parameters of the semiconductor and th e contact. The TLM estimate is a good first approximation for determin ing the exact value of rho(c) by numerically calculating the resistanc e of the semiconductor. The results obtained are used to study the con tact resistivity of Ni-based ohmic contacts on n-6H-SiC substrates. (C ) 1998 American Institute of Physics.