Thin films of polycrystalline silicon are of great importance for larg
e-area electronic applications, providing, for example, the switching
electronics in many flat-panel displays. Polycrystalline silicon is ty
pically produced by annealing films of amorphous silicon(1) that have
been deposited from the vapour phase, and much research is focused on
lowering the crystallization temperature. It is known that the solid-p
hase crystallization temperature of amorphous silicon can be reduced b
y the addition of certain metals(2), such as nickel(3). Here we show t
hat the rate at which this metal-induced crystallization takes place i
s markedly enhanced in the presence of an electric field. For example,
the crystallization time at 500 degrees C decreases from 25 hours to
10 minutes on application of a modest (80 V cm(-1)) electric field. No
residual amorphous phase can be detected in the films. A thin-film tr
ansistor fabricated from such a film exhibits a field-effect mobility
of 58 cm(2)V(-1)s(-1), thereby demonstrating the practical utility of
these materials.