M. Yeadon et al., SINTERING OF SILVER AND COPPER NANOPARTICLES ON (001) COPPER OBSERVEDBY IN-SITU ULTRAHIGH-VACUUM TRANSMISSION ELECTRON-MICROSCOPY, Nanostructured materials, 10(5), 1998, pp. 731-739
The sintering of copper and silver nanoparticles with single crystal c
opper substrates has been studied using a novel in-situ ultrahigh vacu
um transmission electron microscope (UHV TEM). The system is equipped
with a UHV DC sputtering attachment enabling metal nanoparticles to be
generated in-situ and transferred directly into the microscope in the
gas phase. In both cases, we find the particles to be of initially ra
ndom orientation on the substrate. Upon annealing, however, the partic
les reorient and assume the same orientation as the substrate. The pro
cess apparently occurs by a mechanism involving sintering and grain gr
owth. In the case of silver on copper, grain growth cannot occur since
the metals are immiscible. Our observations show that, upon annealing
, the particles wet the substrate surface and form epitaxially oriente
d islands by surface diffusion and grain boundary migration. The post-
anneal islands exhibit the orientation relationship (111)Ag parallel t
o(001)cu, [110]Ag parallel to[110]Cu. (C) 1998 Acta Metallurgica Inc.