B. Ilge et al., THE TEMPERATURE EVOLUTION OF ULTRA-THIN FILMS IN SOLID-PHASE REACTIONOF CO WITH SI(111) STUDIED BY SCANNING-TUNNELING-MICROSCOPY, Surface science, 414(1-2), 1998, pp. 279-289
The solid-phase reaction of 5 Angstrom of Co with the Si (111) surface
is investigated by scanning tunneling microscopy (STM) in the range f
rom room temperature to 700 degrees C. Room-temperature deposition lea
ds to a granular film surface. The small grains transform upon anneali
ng between 200 and 300 degrees C into triangular surface terraces with
step heights of 1.5 and 3.1 Angstrom. Further annealing up to 500 deg
rees C leads to their growth and a decrease of the relative number of
1.5 Angstrom steps. These observations are explained by the formation
of a cobalt silicide with a CsCl-type lattice. Furthermore, apart from
the known 2x2 reconstructions and the unreconstructed surface, variou
s surface features like individual double-line-shaped defects and step
s with a height of 0.4 Angstrom are resolved. Finally, the formation o
f pinholes is observed after annealing: at 500 degrees C. They lead up
on further annealing to a complicated pinhole-induced CoSi2 network th
at breaks up into individual islands at similar to 700 degrees C. (C)
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