ETCHING OF SIC USING INDUCTIVELY-COUPLED PLASMA

Single-crystal SiC etching in an inductively coupled plasma (ICP) cham ber using a gas mixture of O-2/CF4 has been investigated for the first time. The dependence of etch rate on ICP power, substrate dc bias, an d oxygen percentage was studied. It is found that etch rate increases with ICP power and substrate de bias, and an etch rate exceeding 200 n m/min can be obtained at -100 V substrate de bias. The etch rate is as high as 20 nm/min, even when there is no substrate bias. Clean and sm ooth surfaces can be obtained readily. Trenches with different depths were etched and their profiles were examined by scanning electron micr oscopy.