VIA-ON-CHIP PACKAGE AIMS AT HIGH-REL, HIGH-DENSITY ICS

Authors
CHIN S
Citation
S. Chin, VIA-ON-CHIP PACKAGE AIMS AT HIGH-REL, HIGH-DENSITY ICS, Electronic products, 41(5), 1998, pp. 26-26
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronic products → ACNP
ISSN journal
00134953
Volume
41
Issue
5
Year of publication
1998
Pages
26 - 26
Database
ISI
SICI code
0013-4953(1998)41:5<26:VPAAHH>2.0.ZU;2-D