Rj. Pieper et Ad. Kraus, PERFORMANCE ANALYSIS OF DOUBLE STACK COLD PLATES COVERING ALL CONDITIONS OF ASYMMETRIC HEAT LOADING, Journal of electronic packaging, 120(3), 1998, pp. 296-301
Double stack, force-cooled cold plates, which are used as electronic c
hassis, are investigated for all conditions of unequal temperature and
heat loading. A closed form solution that relates the plate temperatu
res to composite heat loads is derived. This analysis covers all regim
es of operation. In particular, this includes the previously ignored r
egime in which no adiabatic point exists anywhere on either of the fin
s connecting cover and splitter plates, The heat dissipating advantage
of the double stack structure, over a similarly designed single stack
structure, is predicted with the analysis presented in the paper.