S. Stemmer et al., EVOLUTION OF GRAIN-BOUNDARY FILMS IN LIQUID-PHASE SINTERED SILICON-NITRIDE DURING HIGH-TEMPERATURE TESTING, Acta materialia, 46(15), 1998, pp. 5599-5606
Citations number
34
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
Transmission electron microscopy (TEM) is used to study the effect of
high-temperature tests on the amorphous grain boundary films in a comm
ercial, liquid phase sintered silicon nitride ceramic. The thickness o
f amorphous films between silicon nitride grains is characterized by h
igh-resolution TEM. In addition, electron energy-loss spectroscopy is
applied to analyze the composition of grain boundary films. A smaller
equilibrium film thickness is measured in the specimens after testing.
This decrease in film thickness is due to changes in the intergranula
r film chemistry. The composition changes are caused by phase transfor
mations in the secondary crystalline phases, which were observed by TE
M and X-ray diffraction, and by crystallization of residual amorphous
pockets during high-temperature testing. (C) 1998 Acta Metallurgica In
c. Published by Elsevier Science Ltd. All rights reserved.