STEAM-BASED RTP FOR ADVANCED PROCESSES

Rapid,thermal processing in steam-containing ambients is a new method that is strongly aligned with current and anticipated future device ne eds. There are numerous advantages of steam-based rapid thermal proces sing technology in conjunction with the fast ambient switching capabil ity of a single-wafer rapid thermal processing system. Our discussions will include some of the key issues involved in designing integrated steam generator/rapid thermal processing systems that can offer the de sired process control and capability, throughput, and flexibility. The studies presented here focus on the physical and electrical propertie s of the oxides grown in the new integrated steam system; correlate th e oxide growth curves with the model that explains the oxidation behav ior; and briefly show the overall advantages and key areas of integrat ed circuit processing where this technique may be used.