We present simulations of metallization morphologies under ionized Sputter-
deposition conditions. By means of molecular-dynamics simulations using a c
arefully designed interaction potential, we analyze the surface adsorption,
reflection, and etching reactions taking place during Al physical vapor de
position, and calculate their relative probabilities. These probabilities a
re then employed in a feature-scale cellular-automaton simulator, which pro
duces calculated film morphologies in excellent agreement with scanning-ele
ctron-microscopy data on ionized sputter deposition. [S0163-1829(99)51612-3
].