A system has been developed to directly measure the flow of inert gases thr
ough an arbitrary thin film. The system employs a porous aluminum silicate
ceramic as the substrate for film deposition, a flow control apparatus to h
old the substrate under vacuum and allow a helium gas pressure differential
to be established across the substrate, and a helium leak detector to meas
ure the flow of helium through the substrate/film combination. This allows
calculation of the permeability of the film. The permeability of plasma enh
anced chemical vapor deposited diamondlike carbon films and sputter deposit
ed silicon nitride, and nickel films were measured. A thermally grown silic
on dioxide film was also tested. (C) 1999 American Institute of Physics. [S
0034-6748(99)04704-8].