Flexural vibrations of semiconductor wafers in the presence of a pulsed thermal excitation source

Citation
Am. Orlov et al., Flexural vibrations of semiconductor wafers in the presence of a pulsed thermal excitation source, TECH PHYS L, 25(3), 1999, pp. 191-193
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
TECHNICAL PHYSICS LETTERS
ISSN journal
10637850 → ACNP
Volume
25
Issue
3
Year of publication
1999
Pages
191 - 193
Database
ISI
SICI code
1063-7850(199903)25:3<191:FVOSWI>2.0.ZU;2-V
Abstract
An analysis is made of the action of current pulses on a metal film lying o n a semiconductor wafer. It is shown that the passage of current pulses of amplitude (1-7) X 10(10) A/m(2) and duration 50-200 mu s across aluminum tr acks excites sound. Experimental dependences of the energy of the flexural vibrations as a function of the duration and amplitude of the pulsed action were obtained. It was observed for the first time that the melting of a me tal-semiconductor contact is accompanied by an abrupt increase in the energ y of the flexural vibrations of the wafer. (C) 1999 American Institute of P hysics. [S1063-7850(99)01103-9].