This letter reports on the fabrication and electrical characterization
of wafer-fused GaAs/Si heterojunctions. A detailed study of the effec
t of surface preparation on bonding GaAs to Si was performed. The curr
ent-voltage (I-V) characteristics of both n-GaAs/n-Si and p-GaAs/p-Si
were measured from 77 K to room temperature. The forward I-V character
istics were analyzed using a numerical model that includes thermionic
emission across the heterojunction. Specifically, a p-GaAs/p-Si hetero
interface of high electrical quality was obtained by direct hydrophobi
c bonding. (C) 1998 American Institute of Physics. [S0003-6951(98)0034
2-8].