Jh. Lee et Yk. Choi, A NUMERICAL STUDY ON FLOW AND HEAT-TRANSFER CHARACTERISTICS OF FILM-COOLING WITH A COMPOUND ANGLE HOLE, KSME INTERNATIONAL JOURNAL, 12(5), 1998, pp. 963-971
A numerical simulation has been performed for the investigation of flo
w and heat transfer characteristics of a film cooling system injected
through a hole with compound angle orientation. The finite volume meth
od is employed to discretize the governing equations based on the non-
orthogonal coordinate with non-staggered variable arrangement, In orde
r to analyze flow and heat transfer characteristics, velocity, tempera
ture, aerodynamic loss coefficient, skin friction and vorticity are ca
lculated with the variation of the skew angle. The maximum longitudina
l vorticity and aerodynamics loss depend strongly on the skew angle, F
or the symmetric case of beta=0 deg, a pair of counter-rotating vortic
es are formed and the maximum value of the film cooling effectiveness
has appeared in the center plane where the skin friction is the minimu
m. For the skew angle of beta=30 deg and above, only one strong counte
r-clockwise vortex remains in the downstream region and the maximum va
lue of the film cooling effectiveness are obtained on the right side o
f the vortex. The predicted results for the film cooling effectiveness
show good agreements with previous experimental data except the near-
hole region.