THERMAL INVESTIGATION OF AN INFRARED REFLOW OVEN WITH A CONVECTION FAN

A two-dimensional numerical model for an infrared reflow soldering wit h a convection fan is used by modifying the Eftychiou's numerical mode ling. The two-dimensional tunnel model which predicts convective condi tions within the reflow oven are solved using the finite volume method with the SIMPLER algorithm. The card model solves the transient two-d imensional heat conduction equation in conjunction with a radiative he at transfer analysis. We also performed an experiment to validate the numerical modeling. The numerical result shows excellent agreement wit h experimental data. Based on the capability of this model, parametric simulations are performed to determine the thermal response of the so lder to variations in the oven operating conditions and heal transfer conditions. This study shows that radiation and conveyor velocity are important factors in the preheat region.