CHIP-SCALE MODULES FOR HIGH-LEVEL INTEGRATION IN THE 21ST-CENTURY

This paper describes a new level of integration and innovation require d to meet the integrated circuit (IC)- and system-level challenges of the 21(st) century. We present a technology platform in which chip-sca le modules (CSMs) provide greater functionality, higher performance, l ower cost, and faster time to market for many of today's emerging prod ucts. Our approach is to build CSMs that overcome formidable integrati on barriers without compromising individual IC technologies. By integr ating various IC technologies and their supporting components, we exce ed single on-chip performance. Functionality is increased through inte gration, and performance is improved by maintenance of an on-chip elec trical environment. Applications include integrating large blocks of m emory with logic, mixing analog and digital IC technologies, and integ rating high-frequency ICs with high-quality (high-Q) passive component s. The CSM technology platform is poised to unlock the full potential of IC technology and unleash the innovations of designers.