J. Horvat et al., EFFECTS OF MECHANICAL DEFORMATION ON CRITICAL-CURRENT OF BI-2223 AG TAPES/, Superconductor science and technology (Print), 11(10), 1998, pp. 1098-1100
The influence of mechanical deformation on critical current has been s
tudied, in order to assess the effect of sample handling on the curren
t carrying capabilities of Bi-2223/Ag tapes. Transport critical curren
t was measured at 77 K using a 1 mu V cm(-1) criterion. The effect of
progressive bending of the tapes on grain connectivity and flux pinnin
g were investigated by measuring I-c against H. It was observed that b
ending can affect weak and strong links to a different degree. Damaged
samples have a low J(c0), but often have a large critical current whi
ch is carried through strongly linked paths, compared to I-c carried t
hrough weak links. The influence of tensile deformation on I-c0 was al
so studied, I-c0 was found not to degrade until the deformation of the
tape approached its elastic limit.